19% of failures are caused by Humidity
Low humidity levels in a computer room increase the risks associated with static electricity. According to ASHRAE, relative humidity greater than 60% increases the risk of oxidation of the metallic parts. Above 60% RH, there also develops a phenomenon that electronic equipment manufacturers have identified as “Hygroscopic dust failures”, which is known to cause electrical failures.
A hygroscopic substance is a substance that has the ability to absorb moisture from the air. For example, calcium chloride (widely used in Quebec on the roads in winter) is part of those substances that can absorb large amounts of water forming a liquid solution. Therefore is a potential risk factor. As it isn’t always possible to avoid water leaks, it is necessary to control this risk by eliminating the presence of contaminating particles inside TI equipment while maintaining the level of relative humidity around 50%.